MEMS Alliance Spring 2005 Workshop
The Post Telecommunication Boom
18-19
April 2005
April 18th
10:00
– 4:00 MEMSCAP sponsored MUMPs¨ User Group Meeting
all MEMS ALLIANCE attendees welcome, Lunch is included
TOPICS
PRESENTED
¥
Why Standard
Processes?
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Technical Overview of
MUMPs¨
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Presentation of MUMPs
Reference Material
¥
CMOS-MEMS Through
ASIMPS
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MUMPs-PLUS:
Semi-Custom Processing
¥ MUMPs¨ at JHU APL
4:00-7:00 MEMS ALLIANCE MID ATLANTIC Reception and Poster
Session
(registration open)
April 19th
8:30-8:45 Greetings and Welcome
8:45 – 9:30 (Keynote) ÒMEMS and the Telcon Bubble,Ó Dr. Richard Payne: Vice President of
Engineering and Manufacturing, Polychromix,
9:30-10-15 (Invited) ÒMEMS in
Wireless Applications,Ó Dr.
David Nagel, George Washington University,
10:15-10:30 Break
10:30-10:55
ÒA MEMS Capacitive Shunt Switch with a Finite GroundÓ, Dr. Jeyasingh Nithianandam, Morgan State University
10:55-11:20
ÒA MEMS Electron Gun with Carbon Nanotube EmittersÓ, Dr. Brian Jamieson, NASA GSFC
11:20-11:45 ÒMulti- and Single-layer Structure network
adaptable and CMOS compatible SAW Sensor: Characterization and simulationsÓ, F. Hassani and M. Rahaman, The
George Washington University
11:45-12:30 (Invited) ÒInteractions of light
with nanostructured MEMS for physical sensing,Ó Dr. Dustin Carr, Sandia National
Laboratories
12:30-1:30 Lunch
1:30-2:15 (Invited) ÒProbing the Micro WorldÓ, Dr. Beth Pruitt, Stanford University
2:15-3:00 (Invited) ÒMEMS - new paradigm in research labs: from Biology to Materials Science,Ó
Dr. Taher Saif, University of Illinois
3:00-3:50 Poster Session
3:50-4:15
ÒDesign and Characterization of CMOS Surface Acoustic Wave Resonator: with
telecommunication and sensor applications,Ó Anis Nurashikin Nordin, The George Washington University
4:15-4:40
ÒMicrofabrication of Ultra-Sensitive Quartz Crystal Microbalance (QCM) Using
Inductively Coupled Plasma Reactive Ion Etching (ICP-RIE) for Sensor
ApplicationsÓ, A. Goyal, Penn State
University
4:40-5:05 ÒMEMS Nanopositioning Mechanisms: Design
and Experimental CharacterizationÓ,
Jason J. Gorman, National Institute of Standards and Technology